May 13, 2022

Winbond continues to expand DDR3 SDRAM production

Winbond’s 1.35V DDR3 products support a data rate of 2133 Mbps in both x8 and x16 configurations and are 100% compatible with 1.5V DDR3. Winbond’s DRAM Roadmap now supports 1GB-4GB DDR3, 128MB-2GB DDR2, 512MB-2GB LP-DDR2, as well as LP-DDR4x, LP-DDR3, LP-DDR, SDRAM interfaces for applications requiring high density DRAM products 4GB or less, such as AI Accelerator, IoT, Automotive, Industrial, Telecom, WiFi-6, WiFi-6e, xDSL, Fiber Optic Network, Smart TV, decoder, IP camera and many more. Winbond is also adding new wafer capacity at the new Kaohsiung plant, Taiwan from the fourth quarter of 2022 which offers more advanced manufacturing technologies. Now, Winbond DDR3 shipments account for 30% of total DRAM revenue and are expected to increase to 50% in 2024.

“Winbond has been providing competitive DDR3 products for 10 years and will continue to provide DDR3 in the next 10 years with superior customer support and product quality,” says Winbond. “Today, our customers continue to demand DDR3 SDRAM products and our goal is to continue this proven legacy to ensure we can meet customer demand for longevity,” added Winbond.

For more information on Winbond’s DDR3 products, visit

About Winbond

Winbond Electronics Corporation is a total memory solution provider. The company provides customer-focused memory solutions, backed by the expert capabilities of product design, R&D, manufacturing and sales departments. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash and TrustME® Secure Flash, is widely used by Tier 1 customers in the communication, consumer electronics, automotive markets and industry, and computer peripherals. Winbond is headquartered in Central Taiwan Science Park (CTSP) and has subsidiaries in the UNITED STATES, Japan, Israel, China and hong kongand Germany. Based on Taichung and new Kaohsiung 12 inch factories in TaiwanWinbond keeps pace to develop in-house technologies to provide high quality memory IC products.

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners.

Product details
Sierra Lai
DRAM Director
TEL: +886-3-567-8168 ext. 75373
E-mail: [email protected]

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Yulia Lee
Marcom Manager
TEL: +886-3-567-8168 ext. 75395
E-mail: [email protected]

Jessica Chiou-Jii Huang
Financial director
TEL: +886-3-567-8168/+886-987-365-682

SOURCEWinbond Electronics Corporation